µm-Scale ITO Patterning
Laser-written line structures are demonstrated on an ITO thin film, showing controlled micron-class linewidth and repeatable routing geometry.
Laser Thin-Film & Photonic Processing
Thin-Film &
Photonic Patterning
薄膜圖案化與光子結構
Precision laser patterning for conductive films, metal layers, liquid-crystal photonic elements, periodic structures and optical waveguide features.
博隆依薄膜與基材堆疊、圖案尺寸、選擇性移除需求及光學功能，規劃雷射波長、偏振、光束形式、掃描路徑、干涉條件與製程 DOE。
Thin Films · AR/VR · Photonic Structures
µm-ClassLine and pattern definition
SelectiveFilm removal with substrate control
ProgrammablePolarization and pattern control
2D / 3DPlanar and shaped-component processing
Capability Overview
Laser-Defined Electrical and Optical Functions
Bolite develops laser processes for selective thin-film removal, micron-scale circuit definition and photonic-structure formation. The platform supports conductive-film patterning, 3D routing, polarization-controlled photoalignment, laser interference lithography and localized optical-feature fabrication.
博隆會依薄膜吸收特性、基材耐受度、膜厚、線寬／間距、殘留膜要求與功能驗證方式，建立適合的能量密度、焦點、偏振、光束重疊、掃描速度及多道次加工策略。
01
Layer-Selective ProcessingRemove or modify a target film while controlling interaction with the underlying substrate.
02
Pattern and Polarization ControlDigital paths, programmable polarization and interference conditions enable diverse structures.
03
Function-Oriented ValidationGeometry can be reviewed together with electrical, optical or diffraction performance.
Key Capabilities
從薄膜選擇性移除到光子功能結構
博隆可依透明導電膜、金屬薄膜、液晶光學與光波導元件需求，提供製程可行性評估、DOE、樣品製作、形貌量測及功能驗證規劃。
Demonstrated Results
代表性薄膜與光子結構成果
以下案例展示 ITO 微米級圖案、導電與金屬薄膜選擇性移除、三維微電路路由、液晶幾何相位元件、雷射干涉微影及光波導 45° 反射面。實際規格須依材料堆疊與功能測試確認。
Selective Film Removal & 3D Routing
Demonstrated cases include conductive-film opening, localized copper-foil removal and metal-film patterning across a chamfered three-dimensional component.
Pancharatnam-Berry Phase LC Lens
Laser polarization-induced photoalignment enables pixel-by-pixel orientation control for geometric-phase liquid-crystal lens structures.
Periodic Patterns & Waveguide Features
Laser interference lithography creates diverse periodic microstructures, while localized processing demonstrates a 45-degree mirror surface for optical waveguide coupling.
Materials & Structures
Items for Evaluation
ITO / TCO FilmsConductive Thin FilmsCopper FoilMetal FilmsGlass SubstratesPolymer SubstratesPhotoalignment LayersLiquid Crystal DevicesCoated 3D ComponentsOptical Waveguides
實際選擇性、最小線寬、加工邊緣、殘留膜、基材損傷與光學功能，須依膜層成分、厚度、基材、表面狀況與後續量測方式進行評估。
Applications
Potential Applications
Displays & Transparent Electronics
ITO 電極、感測線路、透明導電圖案與顯示元件製程開發。
AR/VR & Geometric-Phase Optics
液晶取向、幾何相位元件、薄型光學與可程式化偏振結構。
3D Electronics & Interconnects
三維零件表面的金屬膜圖案、互連路徑及選擇性絕緣區製作。
Silicon Photonics & Optical Packaging
光波導反射面、耦光界面、週期性結構及光子封裝原型。
Development Workflow
From Layer Stack Review to Functional Pattern
STEP 01Requirement Review確認薄膜、基材、圖案檔、線寬、面積與電／光功能需求。
STEP 02Stack & Optical Review評估膜厚、材料吸收、基材耐受度、偏振及光束配置。
STEP 03DOE Patterning測試能量、速度、焦點、Pass、線距、偏振或干涉條件。
STEP 04Metrology & Function Check檢查線寬、深度、殘留、邊緣與客戶指定電性或光學結果。
STEP 05Pilot & Integration評估治具、視覺對位、批次加工、節拍與設備整合。
Information Required
製程評估前請提供的資料
請提供材料堆疊、圖案尺寸、目標加工層、功能需求與驗收方式，博隆可據此規劃雷射選擇、DOE、量測及樣品製作方案。
Substrate material, grade and dimensions
Film material, composition and thickness
Complete layer stack and layer sequence
Target layer to remove, modify or expose
Pattern file in DXF, CAD, Gerber or image format
Target linewidth, spacing and dimensional tolerance
Pattern area, repetition and alignment marks
Planar, curved, chamfered or 3D surface geometry
Allowed residual film and edge-quality criteria
Maximum substrate damage or heat-affected zone
Electrical continuity, resistance or isolation criteria
Optical, diffraction, polarization or coupling criteria
Surface cleanliness and particle requirements
Inspection, metrology and acceptance method
Sample quantity and target production takt time
Schedule, handling, cleanroom and NDA needs
Minimum feature size, film selectivity, electrical performance and optical efficiency must be verified using the customer's actual material stack, geometry and acceptance method.
Start a Patterning Evaluation
Ready to Evaluate Your Thin-Film or Photonic Structure?
提供薄膜與基材堆疊、圖案檔、線寬／間距、加工區域、電性或光學驗收要求，博隆技術團隊將協助評估雷射圖案化與功能結構製程。詳細參數與專有技術可於 NDA 與專案協議下進一步討論。