600 × 600 mm Laser Debonding
Large-format processing is demonstrated on a 600 × 600 mm bonded panel, showing the platform’s ability to cover an extended working area.
LASER RELEASE & PRECISION CLEANING
Laser Debonding & Particle Removal
雷射解鍵合與非接觸式粒子移除
Controlled laser processing for large-area bonded structures and contamination-sensitive precision surfaces.
博隆提供雷射解鍵合、分離製程與乾式非接觸粒子移除的可行性評估、參數開發、樣品處理及自動化整合。
Debonding · Separation · Dry Cleaning
600 × 600 mmDemonstrated debonding area
Non-ContactNo mechanical cleaning contact
Dry ProcessNo chemical solvent required
Inspection ReadyVisual verification and automation integration
Capability Overview
Release Bonded Structures and Clean Precision Surfaces
Bolite develops controlled laser processes for debonding bonded structures and removing particles from sensitive surfaces. A 600 × 600 mm debonding and separation case has been demonstrated, while particle-removal development focuses on selective detachment with reduced risk of scratches, residues and secondary contamination.
博隆會依材料堆疊、吸收層、黏著層、基材尺寸、翹曲、污染種類及表面損傷限制，規劃雷射波長、能量密度、光斑、重疊率、掃描路徑、治具、視覺定位與驗證方式。
01
Controlled Energy DeliveryLaser energy is localized at the target interface or particle location.
02
Low-Contact-Risk ProcessingDebonding and dry cleaning reduce dependence on mechanical contact.
03
Process & Equipment IntegrationMotion, fixture, vision, inspection and automation can be evaluated together.
Key Capabilities
從大面積解鍵合到精密表面乾式清潔
依客戶材料、界面結構與驗收需求，提供可行性測試、DOE、樣品處理、分離／清潔驗證及設備化評估。
Demonstrated Results
代表性解鍵合與粒子移除成果
以下案例取自博隆現有展示資料。600 × 600 mm 為大面積解鍵合案例；粒子移除案例展示設備、加工環境及清潔前後表面影像。實際製程結果須依樣品與驗收方法確認。
Debonding & Controlled Separation
The demonstrated workflow combines laser interface processing with subsequent panel separation and handling.
Laser Particle Removal Platform
A controlled laser system is used for non-contact dry cleaning of precision surfaces, with potential integration of motion, vision and inspection functions.
Before / After Surface Cleaning
Microscope images demonstrate localized particle removal and a visibly cleaner processed region after laser treatment.
Materials & Structures
Items for Evaluation
Glass CarriersBonded Glass PanelsSilicon WafersTemporary Bonding LayersAdhesive / Release LayersOptical SurfacesCoated GlassPrecision MoldsProbe ComponentsPhotomask Components
實際解鍵合窗口與清潔效果須依雷射穿透／吸收條件、鍵合層、基材厚度、表面鍍膜、污染種類、粒徑與允許損傷進行評估。
Applications
Potential Applications
Advanced Packaging Debonding
暫時鍵合載板、晶圓／玻璃載板分離及後段封裝製程開發。
Large-Panel Separation
大尺寸玻璃、顯示與光電結構的局部或全面解鍵合評估。
Semiconductor & Photomask Cleaning
晶圓、光罩及污染敏感元件的非接觸粒子移除。
Optics & Precision Manufacturing
光學表面、精密模具、感測元件及高價值零件的乾式清潔。
Development Workflow
From Stack Review to Verified Release or Cleaning
STEP 01Requirement Review確認材料堆疊、尺寸、鍵合層／污染物與驗收目標。
STEP 02Optical & Interface Review評估穿透、吸收、熱敏感性、表面鍍膜及損傷限制。
STEP 03DOE Processing測試能量、光斑、重疊率、速度、Pass、焦點及掃描路徑。
STEP 04Release / Cleanliness Check檢查分離狀態、殘留、粒子、表面品質與客戶指定功能。
STEP 05Pilot & Automation評估治具、搬運、視覺、批次處理、節拍及設備整合。
Information Required
製程評估前請提供的資料
完整的材料堆疊、污染資訊及驗收標準，有助於博隆判斷雷射作用界面、DOE 範圍與所需量測方式。
Substrate and carrier material, grade and dimensions
Complete bonded stack and layer sequence
Bonding, adhesive or release-layer material and thickness
Target interface for laser interaction
Laser-side transparency or absorption information
Sample warpage, flatness and handling restrictions
Required debonding area and scanning boundary
Allowed residue, crack, discoloration or heat effect
Particle type, estimated size and surface density
Surface material, coating and roughness requirements
Before / after inspection and cleanliness criteria
Quantity, target tact time and automation requirement
Final debonding yield, separation force, particle-removal efficiency, surface damage, cleanliness level and production tact time must be verified using the customer’s actual samples and acceptance method.
START A PROCESS EVALUATION
Have a Debonding or Surface-Cleaning Challenge?
提供材料堆疊、樣品尺寸、目標界面、污染狀況及驗收方式，博隆技術團隊將協助評估適合的雷射製程與驗證方案。