Adhesive-Free Quartz-Glass Welding
A localized laser weld line demonstrates direct joining of transparent substrates without an adhesive layer at the bonding interface.
Precision Laser Joining
Laser Direct Welding
雷射直接焊接與精密封裝
Localized, high-precision laser joining for transparent substrates, silicon-glass interfaces, hermetic metal packages and miniature precision components.
博隆依據材料組合、接合介面、結構設計、對位精度與驗證需求，開發局部雷射焊接製程，降低膠材、機械固定與大面積熱處理所造成的污染、變形與組裝限制。
Localized · Adhesive-Free · Precision Joining
Adhesive-FreeClean direct joining options
Localized EnergyConfined thermal interaction
Multi-MaterialGlass, silicon and metal cases
Precision PackagingAlignment and interface control
Capability Overview
Localized Bonding for Clean and Precise Assembly
Bolite develops laser direct welding processes by coordinating wavelength, focal position, energy deposition, weld path, interface contact and precision alignment. The process can create localized bonding while reducing the need for adhesives, mechanical fasteners or large-area thermal treatment.
博隆依材料吸收、熱膨脹差異、接合介面、間隙、表面狀況與產品驗收方式，建立對應的雷射條件、焊接路徑、治具策略及加工後檢測方法。
01
Interface Energy ControlConfined energy deposition at the target bonding interface.
02
Clean Localized BondingReduced adhesive, residue and large-area heating requirements.
03
Alignment & ValidationJoint positioning, weld-path inspection and application-specific testing.
Key Capabilities
從透明材料接合到微型零件精密焊接
博隆可依材料組合與產品功能，進行接合設計評估、雷射 DOE、樣品製作、焊道檢查及可靠度驗證規劃。
Demonstrated Results
代表性雷射直接焊接案例
以下展示 Quartz-Glass、Kovar-Kovar、鐘錶微型零件及 Silicon-Glass 的雷射接合成果。實際接合強度、氣密性、節拍與可靠度須依材料、結構及測試標準重新評估。
Kovar-Kovar Hermetic Welding
Before-and-after images show localized weld formation on a Kovar package, supporting hermetic-sealing process development for sensitive electronics.
Laser Welding for Watch Parts
A miniature hour socket made from a copper-nickel-zinc alloy is joined to a silicon gear, demonstrating precision micro-component assembly.
Si-Glass Localized Bonding
Localized bonding at a silicon-glass interface supports clean, accurately aligned assembly for MEMS, optical sensors, microfluidics and advanced packaging.
Materials
Materials for Evaluation
QuartzGlassSiliconKovarCopper-Nickel-Zinc AlloyOptical GlassBorosilicate GlassFused SilicaMetalsTechnical Ceramics
上傳案例已展示 Quartz-Glass、Si-Glass、Kovar-Kovar，以及 Copper/Nickel/Zinc Alloy 與 Silicon 微型零件接合；其他材料組合須依吸收、熱膨脹、介面接觸與可靠度要求進行可行性測試。
Applications
Potential Applications
MEMS & Hermetic Packaging
感測器、微機電元件與敏感電子元件之保護封裝。
Optical & Sensor Modules
Sensor Window、光學元件與精密對位模組接合。
Microfluidic Devices
透明流道晶片、封蓋與微流體元件之無膠接合評估。
Precision Micro-Components
鐘錶、微型機構與高價值精密零件之局部組裝。
Development Workflow
From Joint Design to Verified Weld
STEP 01Requirement Review確認材料組合、接合結構、功能與驗收方式。
STEP 02Interface Strategy規劃能量沉積、焦點、治具、接觸與對位方式。
STEP 03DOE Development測試功率、速度、焊接路徑、Pass 數與熱管理。
STEP 04Inspection & Validation檢查焊道、介面、強度、氣密、外觀及功能結果。
STEP 05Pilot & Integration評估節拍、治具、品質判定與自動化設備整合。
Information Required
製程評估前請提供的資料
請提供材料組合、接合介面、焊接位置、產品功能與驗收方法，博隆可據此規劃 DOE、治具、焊接路線及測試方式。
Material pair and material grades
Sample dimensions and thickness
Joint stack-up and interface configuration
Welding position, path and target area
Surface coating, treatment and cleanliness
Contact condition, gap and flatness
Alignment tolerance and fixture constraints
Adhesive-free or hermetic requirement
Strength, pull, shear or peel test method
Leak-rate or hermeticity requirement
Optical, cosmetic and contamination limits
Thermal budget and HAZ limitation
Drawing, photo, CAD and reference sample
Target quantity and takt-time expectation
Reliability and downstream process conditions
Schedule, sample availability and NDA needs
Final joint performance, processing time and acceptance criteria are confirmed after material, interface and validation review.
Start a Laser Welding Evaluation
Ready to Evaluate Your Joining Requirement?
提供材料組合、接合結構、焊接區域、目標強度或氣密要求，以及預計數量，博隆技術團隊將協助評估雷射直接焊接方案。詳細製程參數與專有技術可於 NDA 與專案協議下進一步討論。