Sapphire Wafer with Fan-Out Circuits
Precision laser drilling integrated with a fan-out circuit layout, demonstrating dense and position-controlled hole processing on sapphire.
Laser Micro-Drilling & Cutting
Micro Drilling & Free-Form Cutting
微孔加工與自由曲線切割
Precision laser processing for through holes, blind holes, shaped apertures, dense arrays and free-form contours on hard, brittle, transparent and thin-film materials.
博隆可依材料、厚度、孔型、孔徑、深度、錐度、間距與輪廓圖面，規劃雷射鑽孔、盲孔蝕刻及自由曲線切割製程，支援單一結構、密集陣列與客製化幾何形狀。
Through Hole · Blind Hole · Array · Freeform
Through / BlindMultiple hole configurations
Sapphire / SiCHard-material demonstrations
Glass / PITransparent and thin-film cases
CustomizableDiameter, pitch, shape and contour
Capability Overview
Precision Hole Formation and Contour Processing
Bolite develops laser micro-drilling and free-form cutting processes by coordinating beam delivery, focal control, scan path, layer removal and motion strategy. The platform supports through holes, blind holes, tapered apertures, non-circular geometries, dense arrays and customized contours.
博隆依據材料吸收、厚度、鍍膜結構、入口與出口尺寸、側壁與錐度、崩邊、熱影響及加工節拍，建立對應的雷射條件、掃描策略與檢測方式。
01
Hole Geometry ControlRound, triangular, paired-square and customized apertures.
02
Array ProcessingControllable pitch, density, layout and processing area.
03
Edge & Taper ReviewEntrance, exit, sidewall and contour inspection for optimization.
Key Capabilities
從微孔陣列到自由輪廓的客製製程
博隆可依孔洞功能、材料特性與驗收方式，進行雷射加工策略、DOE、樣品製作及量測驗證。
Demonstrated Results
代表性雷射鑽孔與切割案例
以下展示 Sapphire、SiC、Coated Glass 與 PI Film 的加工成果，以及圓形、三角形與方形盲孔陣列。實際規格須依材料、厚度與驗收標準重新評估。
Shape-Controlled Blind-Hole Arrays
Circular, triangular and paired-square structures demonstrate flexible aperture geometry, pitch and array-layout control.
SiC Through-Hole Array
A high-density through-hole array on hard and brittle silicon carbide, with customizable hole diameter, pitch, array size and pattern.
Free-Form Glass Cutting & PI Drilling
Free-form contours on coated glass and circular aperture processing on polyimide film demonstrate support for transparent and flexible materials.
Materials
Materials for Evaluation
SapphireSilicon CarbideGlassCoated GlassPolyimide FilmQuartzSiliconTechnical CeramicsPolymersMetal Foils
上傳案例已展示 Sapphire、SiC、Coated Glass 與 PI Film；其他材料須依厚度、吸收特性、鍍膜、熱性質及目標幾何進行可行性測試。
Applications
Potential Applications
Advanced Packaging
Micro Via、Fan-Out、互連與晶片級封裝結構開發。
Microfluidics & Nozzles
流體孔道、噴嘴、過濾與定量分配結構。
Thermal Management
Thermal Via、散熱孔與高熱通量基板結構。
Optics & Sensors
光學孔徑、遮罩、感測元件與異形基板輪廓。
Development Workflow
From Hole Specification to Verified Sample
STEP 01Requirement Review確認材料、厚度、孔型、輪廓與驗收方式。
STEP 02Process Strategy規劃加工方向、焦點、掃描路徑與治具方式。
STEP 03DOE Development測試能量、速度、層距、Pass 數與輔助條件。
STEP 04Inspection & Review檢查孔徑、深度、錐度、崩邊、輪廓與一致性。
STEP 05Pilot & Scale-Up評估陣列面積、節拍、良率與自動化整合。
Information Required
製程評估前請提供的資料
請提供孔洞或切割輪廓圖面、材料資訊及驗收標準，博隆可據此規劃 DOE、加工路線與量測方法。
Material and material grade
Sample dimensions and thickness
Through hole, blind hole or cutting contour
Hole shape, diameter and target depth
Entrance / exit diameter and taper limit
Pitch, array size and processing area
CAD, DXF or dimensioned drawing
Coating stack or surface treatment
Edge chipping, burr and HAZ limits
Debris, cleanliness and post-cleaning needs
Inspection and acceptance method
Target quantity and takt-time expectation
Downstream process and handling limits
Reference sample, schedule and NDA needs
Final specifications, processing time and acceptance criteria are confirmed after material and process feasibility review.
Start a Drilling & Cutting Evaluation
Ready to Evaluate Your Hole or Cutting Requirement?
提供材料、厚度、孔型或 CAD 輪廓、目標尺寸與驗收標準，博隆技術團隊將協助評估雷射鑽孔、盲孔加工或自由曲線切割方案。詳細參數與專有技術可於 NDA 與專案協議下進一步討論。