Micro QR Code on Silicon
Direct laser marking on silicon for chip- and die-level traceability, with multiple demonstrated code scales.
Laser Micro-Marking
Micro Marking & Traceability
微米級標記與產品追溯
Permanent, high-resolution laser marking for semiconductor, optical, MEMS and precision components.
博隆提供微型 QR Code、Data Matrix、產品識別碼與透明基材內部標記製程，協助客戶建立晶粒、元件及產品單位層級的永久追溯能力。
Surface · Edge · Curved Substrate
50 × 50 µmDemonstrated micro QR on glass
100 × 100 µmDemonstrated reader decoding scale
Surface / InnerFlexible marking location
Unit-LevelChip and component traceability
Capability Overview
Precision Identification at Component Level
Bolite’s laser micro-marking process creates permanent identification features directly on component surfaces, edges, or inside transparent substrates. It is designed for applications where marking space, contamination control, readability, and long-term traceability are critical.
博隆依據材料特性、標記位置、代碼尺寸、資料長度、讀取設備與後續製程條件，建立適合的雷射波長、光束參數、掃描路徑與影像辨識方案。
01
Micro-ScaleUltra-small QR Code and Data Matrix marking.
02
PermanentNon-contact identification designed for long-term use.
03
CustomizableSurface, edge and inner-substrate marking routes.
Key Capabilities
可依產品與讀取條件調整的標記方案
以下六項模組可作為其他 Capability 詳細頁的標準卡片區塊，替換標題與內容即可延伸為不同製程頁面。
Demonstrated Results
代表性雷射標記案例
案例展示不同材料、產品層級與標記位置。實際規格須依材料、表面條件、代碼內容與讀取方式重新確認。
Micro QR Code on Glass
Glass surface-marking case demonstrating micro QR codes down to 50 × 50 µm.
Micro QR Code on MEMS
Device-level identification directly on a MEMS microphone package for production traceability.
Micro 2D code at curved surface
Laser-etched μ-QR code on the edge of the automotive lens for traceability.
Materials
Demonstrated Materials
GlassQuartzSiliconSilicon CarbidePolyimidePlastic LensMEMS PackageOptical Components
實際可行性依材料組成、鍍膜、厚度、表面狀況、標記深度、代碼尺寸及讀取方式評估。
Applications
Application Scenarios
Semiconductor
Wafer、die、MEMS 與封裝元件單位追溯。
Optical Components
鏡片、玻璃與透明元件永久識別。
Automotive
車用鏡頭、感測器與電子元件履歷追蹤。
Precision Devices
小型化、高價值與高可靠度元件識別。
Development Workflow
From Feasibility Test to Pilot Production
STEP 01Requirement Review確認材料、代碼、標記位置與讀取方式。
STEP 02Feasibility Evaluation評估雷射波長、加工位置與主要風險。
STEP 03DOE Development測試能量、速度、線距、焦點與深度。
STEP 04Marking Verification檢查尺寸、對比、表面狀態與解碼結果。
STEP 05Pilot Production建立批次加工、品質判定與資料流程。
Information Required
製程評估前請提供的資料
資訊越完整，越能快速判斷可行性、測試方法與預估開發範圍。
Material and material grade
Sample dimensions and thickness
Surface coating or treatment
Marking position and usable area
QR Code / Data Matrix format
Required code size and data length
Surface or internal marking depth
Reader model and illumination method
Target quantity and takt time
Particle, damage and readability criteria
Drawing, photo or CAD file
NDA and project schedule requirements
Final specifications, acceptance criteria and delivery scope are confirmed after sample and process feasibility review.
Start a Marking Evaluation
Ready to Evaluate Your Marking Application?
提供樣品材料、標記位置、代碼尺寸與讀取需求，博隆技術團隊將協助評估合適的雷射標記方案。詳細製程參數與專有技術可於 NDA 與專案協議下進一步討論。