Multi-Depth Marking in Quartz
Demonstrated internal marking at Z = −50, −100 and −150 µm, showing the relationship between focal plane and observed code contrast.
Femtosecond Internal Marking
Inner Substrate Marking
透明基材內部標記
Permanent identification embedded inside transparent substrates—without directly marking the outer surface.
博隆利用精密聚焦雷射在石英與透明基材內部形成可辨識標記，可用於 Micro QR Code、Data Matrix、序號與客製圖形，兼顧永久追溯、表面潔淨與防篡改需求。
Embedded · Surface-Free · Depth-Controlled
−50 / −100 / −300 µm or deeper Demonstrated focal depths in quartz
Inner MarkingNo direct etching on the outer surface
Multi-DepthLayered identification and depth mapping
Permanent IDEmbedded traceability and anti-tamper use
Capability Overview
Embedded Identification Inside Transparent Materials
Bolite’s inner substrate marking process focuses laser energy beneath the surface of a transparent material to create localized optical contrast. The identification feature is embedded inside the substrate, leaving the external surface available for optical, bonding, cleaning, or downstream assembly requirements.
博隆依據材料折射特性、厚度、目標深度、代碼尺寸、觀察方向及讀取設備，調整焦點補償、能量、掃描路徑與標記結構，建立適合的內部標記製程窗口。
01
No Direct Surface EtchingIdentification is formed below the reference surface.
02
Depth-ControlledMarking position can be evaluated at selected internal depths.
03
Tamper-ResistantEmbedded marks are protected from wiping and surface abrasion.
Key Capabilities
可依材料、深度與讀取方式調整的內部標記方案
標記位置、視覺對比與解碼能力需同步設計；博隆可由單點可行性測試延伸至代碼、陣列與批次定位開發。
Demonstrated Results
基板內部標記代表性結果
目前展示案例包含石英、玻璃等透明基板內部不同深度及多種代碼尺寸。下列數值為特定樣品的展示結果，實際規格須依材料、厚度、深度與讀取條件重新驗證。
Embedded QR Contrast
Internal codes become clearest near the selected observation plane; optical focus and illumination are part of the readability design.
Surface-Free Identification Concept
The mark is positioned inside the substrate, keeping the external surface available for optical use, bonding, cleaning or handling.
Curved Substrate Inner Marking
Different code sizes and internal positions can be arranged in a test matrix to identify a stable process and reading window.
Materials
Materials for Evaluation
Quartz — DemonstratedFused SilicaOptical GlassBorosilicate GlassGlass Core SubstratesOther Transparent Materials
石英為目前展示材料；其他透明材料須依透光波段、折射率、厚度、內部應力與鍍膜條件進行可行性評估。
Applications
Potential Applications
Glass Core / TGV
玻璃核心基板、TGV 元件與先進封裝的內部追溯標記。
Optical Components
在非功能區或指定深度建立永久識別，降低表面磨耗風險。
Semiconductor Packaging
透明蓋板、封裝玻璃與微型元件的批次與單位識別。
Anti-Tamper Traceability
將序號或代碼嵌入材料內部，提高擦除與表面破壞的難度。
Development Workflow
From Depth Evaluation to Readable Embedded Code
STEP 01Requirement Review確認材料、厚度、標記區域、代碼與讀取方向。
STEP 02Optical & Depth Review評估透光、折射、工作距離與可達內部深度。
STEP 03DOE & Depth Mapping測試能量、焦點補償、掃描間距與多個 Z 位置。
STEP 04Readability Verification以顯微影像或指定讀取器確認對比與解碼能力。
STEP 05Pilot Integration建立定位、序號管理、批次加工與品質判定流程。
Information Required
製程評估前請提供的資料
內部標記同時受到材料、光學路徑、深度與讀取條件影響，建議盡可能提供實際樣品與指定讀取設備資訊。
Material type, grade and refractive index if available
Sample dimensions and total thickness
Surface coating, film or surface treatment
Reference surface and marking-side orientation
Target internal depth from the reference surface
QR / Data Matrix type, size and data length
Viewing direction and required reading distance
Reader model, lens and illumination method
Allowed modification zone and optical appearance
Surface-damage, particle and contamination criteria
Target quantity, takt time and positioning tolerance
Drawing, sample, CAD file, NDA and schedule
Demonstrated depths and images are sample-specific. Final specification, readability criteria and delivery scope are confirmed after feasibility testing.
Start an Inner-Marking Evaluation
Ready to Evaluate an Embedded Identification Application?
提供透明基材種類、厚度、標記深度、代碼尺寸與讀取條件，博隆技術團隊將協助規劃內部標記可行性測試。詳細製程參數、光學設計與專有技術可於 NDA 與專案協議下進一步討論。