Micro laser processing system
BL-DW
Application
Laser drilling in micro scale
Laser micro marking
Laser lift-off
Features
Single or dual wavelengths:IR, Green, NUV or DUV
Proprietary free-form laser marking in micro-scale.
Built-in coaxial imaging system for in-situ QC and potential AOI integration.
Custom solutions available.
Specifications
Control Interface: RS232 x 3 / USB x 1 / IO Interface
Supply Voltage (VAC): 220V @10A
Control Unit Dimensions (W × D × H): 480 x 350 x 150 mm
Module Dimensions (W × D × H): 538 x 668 x 179 mm
Cooling: Air-cooled