11 μm Micro marking (letters)
Marking batch numbers or production numbers by lasers can be quite useful in a variety of industries. The minimum resolution of Bolite laser processing can be as fine as 1μm, thereby meeting the requirements of micro marking. Applicable materials include: metals, silicon, SiC, organic compounds and plastics.
programming spot 0.8 μm, pitch 1 μm
Bolite laser processing technology is capable of reaching a precision level down to 1μm. Combined with a scanning galvanometer, rapid processing can be achieved, suitable for circuit or component repair applications.
Laser repair, remove Copper metal on PCB
Bolite laser repair technology can be applied to circuit or component repair, such short to open circuit repair of PCB or mask repair.
33 μm micro marking (QR code)
Laser QR-codes have been widely used in production marking applications, and there are also many types of barcodes to choose from. Bolite can provide the full development and technical support of barcode scanning modules, as well as complete turnkey solutions.
Through glass, 1 μm metal line cutting
Bolite laser cutting technology can process a variety of patterns, with resolution down to 1μm. Laser processing can also be applied to freeform shapes through our proprietary software tool. Bolite can also assist in the software development of automated defect inspection or other post-processing functions.