Laser bonding system

Laser Transmission Bonding with selective heat input allows a small heat-affected zone (HAZ) along the bonding frames. The chips can thus be joined without any temperature load in the functional area on Wafer Level or Chip-Level.

Application

• Wafer to wafer laser bonding

• Glass to wafer laser bonding

• Die on wafer laser bonding

Features

• Multi-wavelength laser, from NUV to NIR laser

• Localized temperature monitor on laser heating / bonding area

• Precisely feedback for heating / bonding temperature control

• Co-axial image

Specification

• Temperature detection range: 473 K to 1800 K (typical)

• Laser spot size: < 500 um